Singulation methods and substrates for use with same

ABSTRACT

A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

FIELD OF THE INVENTION

[0001] The present invention relates to the singulation of circuit boardsubstrate assemblies. Further, the present invention pertains tosingulation methods and circuit board substrates for use with suchsingulation methods.

BACKGROUND OF THE INVENTION

[0002] Substantial savings of time and money have been realized in theindustry by handling a plurality of printed circuit boards (PCB's) whilethey are still interconnected in a panel of substrate material. With useof interconnected PCB's, processing of such interconnected boards (e.g.,populating the PCB's with components, wave soldering of the populatedboards, quality control testing such as electrical function testing ofwhole boards or selected components, and/or encapsulating componentspopulating interconnected PCB's) is more easily enabled. Particularly,such processing of interconnected PCB's is considered very advantageousin the automated processing demands of the electronics industry.

[0003] Methods presently used to separate, i.e., singulate, eachseparate or individual PCB from the interconnected PCB's in the panel ofsubstrate material have typically included shearing, routing, break-awaymethods of routed tabs, scoring, perforation, and various punch and dietechniques.

[0004] For example, routing may be performed to route slots in the panelaround individual PCB's to define the perimeter of the individualboards. Typically, such routing leaves spaced support tabs around theperimeter for holding the individual boards in place. Such tabs are thencut, broken, or routed to singulate individual boards. Further, forexample, scoring has been used for grooving lines along at leastportions of individual board perimeters. Such score lines are then usedto effect board separation by breaking along the score lines. Inaddition, various perforations have been used to define the perimetersof the individual boards. Breaking along the lines of perforation arethen used for singulation of the individual boards. Punch and diemethods of singulation have also been used wherein a custom made die isused to punch each individual board out of the substrate panel and thenpulled back into the panel such that after the individual board ispopulated with components, the boards can be pushed from the panel.Punch and die methods have also been used to remove routed tabs.

[0005] The above methods, and various others, have many associatedproblems. For example, methods of preparing panels for subsequentbreak-away separation of the PCB's populated with components inherentlyrob the panel of its rigidity. Consequently, the panels are prone tosagging during wave soldering, excessive warping, and premature breakageprior to subsequent separation into the individual circuit boards.Perforation and scoring yield very poor quality edges. As such, suchedges cannot be held to close tolerances. Further, punch and die methodsrequire expensive tooling and cannot be used to process configurationsof panels without scrap strips between adjacent individual circuitboards. Further, premature separation during handling of theinterconnected circuit boards may occur with a number of the abovesingulation methods.

[0006] Although routing provides an advantageous singulation method,routing also has particular problems or disadvantages associatedtherewith. For example, excessive treatment by a router can be veryexpensive, particularly due to the cost of router bits and the timenecessary to perform the routing process. For example, routing typicallymust be performed around the entire perimeter of the interconnectedindividual circuit boards, or at least along two or more axes (x, y). Inaddition, although tabs may be utilized to hold the individual circuitboards in place in the interconnected panel of substrate material, thetabs are typically along two different axes of the individual circuitboard, requiring the routing tool to be used along at least twodifferent axes to singulate the individual circuit boards. Further,routing of tabs may still result in remaining tab stubs which mayrequire a secondary procedure for removing such stubs from theindividual circuit boards.

[0007] Various references describe singulation systems. For example,U.S. Pat. No. 4,791,721 describes a singulation system where individualportions of PCB's are interconnected by small break-away tabs so thatthe individual circuit boards populated with components can be separatedwithout damaging the components assembled on a board. This singulationsystem uses a punch technique where a punch or die comes into contactwith the printed circuit board and punches out the interconnectingportions, i.e., tabs. Other systems use a combination of routing andshearing such as described in U.S. Pat. No. 4,742,615.

[0008] Although there are various conventional methods utilized forsingulation of interconnected PCB's, there is a need in the art forother advantageous methods for performing such singulation. Further,there is a need for substrates for utilization with such methods whichprovide such advantages. The present invention provides a singulationmethod and substrate for use in singulation methods which overcome thedisadvantages described above along with other problems as will beapparent from the description below.

SUMMARY OF THE INVENTION

[0009] A singulation method according to the present invention includesproviding a generally planar circuit board substrate assembly having alongitudinal axis extending between a first end and a second end. Thecircuit board substrate assembly further includes a plurality of circuitboard portions lying along the longitudinal axis with at least two ofthe plurality of circuit board portions separated by an opening andconnected by interconnect material. Interconnect material along a firstsingulation axis and a second singulation axis extending substantiallyparallel to the longitudinal axis is removed to singulate at least twocircuit board portions. The first singulation axis and the secondsingulation axis intersecting with respective first and second portionsof the opening.

[0010] In another singulation method, the method includes providing acircuit board substrate assembly having a longitudinal axis extendingbetween a first end and a second end of the circuit board substrateassembly. The circuit board substrate assembly includes a plurality ofopenings positioned along the longitudinal axis with each of theplurality of openings separating two regions of a plurality of circuitforming regions connected by interconnect material. Circuit portions areformed in one or more of the circuit forming regions. Interconnectmaterial is removed along a first singulation axis and a secondsingulation axis extending substantially parallel to the longitudinalaxis. The first singulation axis and the second singulation axisintersect with respective first and second open portions of each of theopenings such that when the material is removed each of the plurality ofcircuit forming regions are singulated.

[0011] In yet another singulation method according to the presentinvention, an elongate circuit board substrate assembly having alongitudinal axis extending along a length of the circuit boardsubstrate between a first end and a second end thereof is provided. Thecircuit board substrate assembly further has a first edge and a secondedge extending along the length of the circuit board substrate assemblybetween the first and second end. A plurality of formed circuit portionsare provided along the longitudinal axis of the elongate circuit boardsubstrate assembly with each of the plurality of formed circuit portionshaving a perimeter located at least a minimum distance from each of thefirst edge and second edge of the circuit board substrate assembly. Eachpair of adjacent formed circuit portions of the plurality of formedcircuit portions are separated by an opening with the opening extendingbetween a position located less than a maximum distance from each of thefirst edge and second edge of the circuit board substrate assembly. Theminimum distance is greater than the maximum distance. Interconnectmaterial along a first singulation axis and a second singulation axis ateach of the first and second edges of the circuit board substrateextending substantially parallel to the longitudinal axis is removed.The first singulation axis and the second singulation axis intersectwith first and second open portions of each of the openings such thatwhen the interconnect material is removed the plurality of formedcircuit portions are singulated.

[0012] In one embodiment of the methods, each opening is a single slotextending generally perpendicular to the longitudinal axis betweenadjacent circuit forming regions.

[0013] In another embodiment of the methods, the circuit board substrateassembly includes a matrix of circuit board portions, the matrix ofcircuit board portions are singulated in a manner similar to the methodsdescribed above.

[0014] A circuit board substrate assembly according to the presentinvention includes a generally planar circuit board substrate materialhaving a longitudinal axis extending along a length of the substratematerial between a first end and a second end thereof. The circuit boardsubstrate material further has a first edge and a second edge extendingalong the length of the circuit board substrate material between thefirst end and the second end. A plurality of openings are defined in thesubstrate material. Each opening extends between a first distance fromthe first edge of the circuit board substrate material and a seconddistance from the second edge of the circuit board substrate material.Further, each opening separates adjacent circuit forming regions lyingalong the longitudinal axis and has first and second opposing endportions. The first end portions of each opening lie along a firstsingulation axis of the substrate material parallel to the longitudinalaxis and the second end portions of each opening lie along a secondsingulation axis of the substrate material parallel to the longitudinalaxis.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015]FIG. 1 is an illustration of a singulation system in accordancewith the present invention.

[0016]FIG. 2 is a top view of an illustrative circuit board substrateassembly showing various alternate embodiments of a substrate assemblyin accordance with the present invention.

[0017]FIG. 3A is a top view of the circuit board substrate assembly asshown in FIG. 1.

[0018]FIG. 3B is a side view of the circuit board substrate assemblyshown in FIG. 3A.

[0019]FIG. 3C is a detail view of a slot between interconnectedindividual circuit board portions of the circuit board substrateassembly of FIG. 3A.

[0020]FIG. 3D is a bottom view of the circuit board substrate assemblyshown in FIG. 3A.

[0021]FIG. 4A is a singulated individual circuit board portion of thecircuit board substrate assembly shown in FIGS. 3A-3D.

[0022]FIG. 4B is a side view of the individual circuit board portionshown in FIG. 4A.

[0023]FIG. 4C is a bottom view of the individual circuit board portionshown in FIG. 4A.

[0024]FIG. 5 is a plurality of circuit board substrate assembliesstacked for singulation in accordance with the present invention.

[0025]FIG. 6 is a circuit board substrate assembly including a matrix ofindividual circuit board portions in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The present invention shall be generally described with referenceto FIGS. 1-4. With the description as provided below, it should bereadily apparent to one skilled in the art that the various processesand structures described with reference to the Figures may be used invarious combinations and configurations. Further, it should be apparentthat the scaling in the Figures does not represent precise dimensions ofthe various elements illustrated therein.

[0027] In this application, “circuit board substrate assembly” refers toany of the following including, but not limited to, printed circuitboard substrate material, a circuit board substrate material populatedwith components, a circuit board substrate material having elementsdefined therein (e.g., openings, slots, markers, alignment holes, etc.),a circuit board substrate material having encapsulated circuitry definedin various regions of the substrate material, circuit board substratematerial having various interconnection patterns and interconnectionmaterials, or any other circuit board substrate material having variouslayers formed thereon, various circuit components mounted thereon,various openings or depressions or projections defined therein orextending therefrom, or any combination of the foregoing or othersimilar structures.

[0028] Further, in this application, circuit board substrate material asused herein refers to any type of circuit board substrate materialincluding, but not limited to, fiberglass, FR4, BT resin, or any othersubstrate materials utilized as known to one skilled in the art in theformation of printed circuit boards, such as any routable material.

[0029] Yet, further, whenever utilized herein, “components” or “contentsof a circuit” shall refer to any structural element includingelectrical, mechanical, resistive, inductive, capacitive, integratedcircuit, metallization, leads, or any other structural element ormaterial formed relative to the substrate material typically utilized inproducing circuitry on a circuit board. Such components may include, butare clearly not limited to, surface mount components, dual in-linepackaged components, chip carriers, capacitive, inductive, or resistivecomponents, metallization for electrical connection such as leads,printed writing, etc.

[0030] It should be readily apparent to one skilled in the art thatwhenever reference is made to a circuit board substrate assembly in thefollowing description, various process steps may have been previouslyutilized to form individual circuits on a particular circuit boardsubstrate material. For example, such processing steps include mountingsteps, molding steps for encapsulating material over circuit components,curing steps, metallization steps, etc.

[0031]FIG. 1 shows a general illustrative singulation system 10 inaccordance with the present invention. Generally, singulation system 10includes a mainframe holding apparatus 12, a material removal tool 14,e.g., a router 18, and a circuit board substrate assembly 20 including aplurality of interconnected individual circuit board portions 22.Mainframe holding apparatus 12 includes a number of clamping members 17for holding and orientating the circuit board substrate assembly 20 inposition during singulation. Further, mainframe holding apparatus 12 mayinclude a motor driven apparatus 16 for moving the mainframe holdingapparatus 12 along an x, y, or z direction as represented generally byarrows 90. It should be readily apparent to one skilled in the art thatthe mainframe holding apparatus 12 will vary depending upon the circuitboard substrate assembly being singulated. For example, variousoperations may occur at the back side of the circuit board substrateassembly requiring an opening beneath the circuit board substrateassembly. Further, for example, if the singulation procedure involves ascoring operation, such an opening beneath the circuit board substrateassembly may not be required.

[0032] The material removal tool 14 may be any one of a number ofsingulation tools available in the current art as represented generallyby dashed box 14. For example, the material removal tool 14 may be ascorer for producing score lines where desired and the means forbreaking material away along the score lines as known by one skilled inthe art. Further, the material removal tool 14 may be a shearing bladefor producing the shearing action along a line as desired. In otherembodiments of the present invention, the material removal tool 14 maybe a perforation tool for providing a line of perforations along anaxis, and further wherein material may be removed by performing abreaking operation along such lines of perforation. It should berecognized that any particular material removal tool 14 capable ofremoving material along a single axis as described herein may beutilized in accordance with the present invention.

[0033] Preferably, the material removal tool 14 is a numericallycontrolled router 18. For example, such numerically controlled routersare known to those skilled in the art and conventionally available. Anysuitable numerically controlled router capable of routing along an axisin accordance with the present invention is contemplated in accordancewith the scope of the accompanying claims. For example, such anumerically controlled router 18 may be a router sold under the tradedesignation of TR1000 available from Cencorp, a router sold under thetrade designation of EX110 available from Excellon Automation Co., etc.It will be readily apparent that the numerically controlled router maybe moved in any x, y, or z direction as represented by arrows 91.However, in accordance with the present invention, the material removaltool 14 need only remove material along a single axis, e.g., singulationaxes 28 and 30 which are peripheral axes spaced a predetermined distancefrom longitudinal axis 26.

[0034] Although the circuit board substrate assembly 20 is shown in aparticular configuration in FIG. 1, which is further described in detailwith respect to FIGS. 3 (FIGS. 3A-3D) and 4 (FIGS. 4A-4C), the circuitboard substrate assembly 20 is shown in more general form in FIG. 2. Asshown in FIG. 2, a circuit board substrate assembly 100 may include anynumber of interconnected individual circuit board portions 122 lyingalong a longitudinal axis 126 of the circuit board substrate assembly100 formed relative to substrate material 135. The individual circuitboard portions 122 are interconnected by respective portions ofperipheral substrate material 123 and 125 which extend between a firstend 132 and a second end 134 of the circuit board substrate assembly100. Generally, the individual circuit board portions 122 may be of anysize and shape as desired. The individual circuit board portions 122 arelocated inward from the respective edges 136 and 138 of the circuitboard substrate assembly 100. Further, the individual circuit boardportions 122 are separated from other circuit board portions 122 by atleast one opening 124 which is defined adjacent individual circuitportions 122 a predetermined distance respectively inward from bothedges 136 and 138.

[0035] Generally, the openings 124 may be of any size or shape asdesired. The openings are defined a maximum distance (d_(max)) from therespective edges 136 and 138 of the circuit board substrate assembly 100dependent at least in part on the size, shape, and position of theindividual circuit board portions 122. The singulation axes 130 and 128intersect opposing ends of each of the openings 124 defined forseparating the individual circuit board portions 122. The distance(d_(max)) at each edge is always less than the distance of the peripheryof the individual circuit board portions 122 from the respective edges.It should be apparent to one skilled in the art that multiple openings124 may be defined between adjacent circuit portions, as shown generallyat reference number 127. Further, it should be readily apparent thatsuch openings may take the form of a slot which is substantiallyperpendicular to longitudinal axis 126 or may take any arcuate, angular,or other size and shape as generally shown by multiple openingconfigurations in FIG. 2, e.g., arcuate, diamond, etc.

[0036] Also, as shown in FIG. 2, one skilled in the art will recognizethat the circuit board substrate material 135 may include any number ofcircuit board portions 122 defined or formed thereon. Further, theperipheral material interconnecting the various circuit board portionsmay have an edge that is not parallel to the longitudinal axis 126 as isgenerally represented by edge 136. However, as one skilled in the artwill recognize, having additional unnecessary material produces anexcess amount of waste. Therefore, to minimize the interconnectmaterial, such edges are parallel to axis 126. Further, as one skilledin the art will recognize from the detailed description of the preferredembodiment below, the openings 124 are preferably slots lyingperpendicular to the longitudinal axis 126 with rectangular-sizedcircuit portions 122 lying adjacent such slot openings 124. As such,waste is again eliminated in that further trimming of the circuit boardportions 122 is minimized after the individual circuit portions 122 aresingulated from the circuit board substrate assembly 100.

[0037] A preferred embodiment of a substrate assembly is shown in FIGS.1 and 3-4. As shown in FIGS. 3A and 3B, circuit board substrate assembly20 includes a generally planar and rectangular shaped panel or strip ofsubstrate material 2. The strip of substrate material 21 includes alongitudinal axis 26 extending between a first end 32 and a second end34 of the circuit board substrate material 21. The circuit boardsubstrate material 21 further includes a first edge 36 extending on oneside of the substrate material 21 between the first end 32 to the secondend 34 and a second edge 38 extending between the first end 32 to thesecond end 34 of the substrate material 21.

[0038] The substrate material 21 can be separated into three distinctivetypes of regions. First, a plurality of circuit forming regions 25 liealong a length of the circuit board substrate material 21 along thelongitudinal axis 26. Circuit forming regions 25 are for use in theformation of circuit portions 31 of the individual circuit boardportions 22. Each of the circuit forming regions 25 is generally ofrectangular shape and has a defined perimeter. Separating each of theplurality of circuit board forming regions 25 from one another areopenings 24 defined in the circuit board substrate material 21. Theopenings 24 are of a slot-like configuration generally lyingperpendicular to the longitudinal axis 26. Interconnecting the circuitforming regions 25 adjacent each respective edge 36 and 38 areinterconnection material regions 27 and 29. Such interconnection regions27 and 29 provide support for the circuit forming regions 25 adjacentthe openings 24.

[0039]FIGS. 3A and 3B show a plurality of encapsulated circuit portions31 formed in the circuit forming regions 25 of the circuit boardsubstrate material 21 resulting in the interconnected individual circuitboard portions 22. As an illustration of a circuit portion 31 which canbe formed relative to the substrate material 21, FIGS. 3 and 4 show abump grid array package outline which includes bumps 48 on the bottomside of the circuit board substrate assembly 20 (FIG. 3D) and anencapsulated or molded package portion 50 formed on the side of thecircuit board substrate material 21 opposite of ball grid array bumps48. As would be readily known to one skilled in the art, the ball gridarray bumps 48 are connected to circuit components encapsulated by themolding material 50 by interconnection circuitry to form a completeencapsulated circuit 31.

[0040] The perimeter of the individual circuit board portions 22,including encapsulated circuit portion 31 formed in the circuit formingregions 25 of substrate material 21, is defined by the openings 24adjacent the circuit board portions and the singulation axes 28 and 30.The singulation axes 28 and 30 lie in parallel relationship tolongitudinal axis 26 of the circuit board substrate material 21, e.g.,the singulation axes 28, 30 and longitudinal axis 26 all lie in the xdirection with each of the singulation axes 28, 30 spaced a distancefrom the longitudinal axis 26.

[0041] As shown in more detail in FIG. 3C, the elongated slot-likeopening 24 extends from a position inward of the edge 36 of circuitboard substrate material 21 to a position inward of edge 38 of circuitboard substrate material 21. The distance of the opening relative to theedge 36 and edge 38 may vary but is shown as d_(max) in FIG. 3C. Thedistance d_(max) depends upon the distance d_(min), i.e., the minimumdistance the formed circuit portion 31 is from the respective edges 36and 38. It will be readily apparent to one skilled in the art that thedistance d_(max) will always be less than the distance d_(min). Further,it should be apparent that the respective distances at either edges 36,38 may vary, but that d_(max) is always less than d_(min), e.g., d_(max)may be different at edge 36 than at edge 38.

[0042] As shown in FIG. 3A, and in further detail in FIG. 3C, thesingulation axis 28 passes through a first end opening portion 42 ofopening 24 of each of the openings 24 separating the plurality ofindividual circuit board portions 22. Further, singulation axis 30intersects with a second end opening portion 40 of each elongatedopening 24. First end opening portion 42 and second end opening portion40 are in opposing relation to one another inward of respective edges 38and 36. With the singulation axis 30 intersecting end portions 40 ofeach opening 24 and with singulation axis 28 intersecting each open endportion 42 of opening 24, removal of material along the respectivesingulation axes 28, 30 (i.e., interconnect regions 27, 29 of substratematerial 21 lying at edges 36, 38) results in singulation of the circuitboard substrate assembly 20 into respective individual circuit boardportions 22. The removal of at least a portion of the interconnectsubstrate material 27, 29 between the openings 24 which separateadjacent pairs of individual circuit board portions 22 result in theplurality of singulated individual circuit board portions 22.

[0043] The singulated individual circuit board portions 22 are shown indetail in FIGS. 4A-4C. In FIG. 4A, the individual circuit board portions22 include singulated edge 56 and singulated edge 57 on opposing ends ofcircuit board portion 22. Extending between singulation edges 56, 57 areopening edges 58, 59. FIG. 4B shows a side view of the individualcircuit board portions 22 including molded encapsulating material 50 andball grid array bumps 48. Further, the underside, i.e., ball grid arraybumps 48 of the individual circuit board portion 22, are shown in FIG.4C.

[0044] The removal of the interconnect substrate material 27, 29 alongthe singulation axes 28, 30 may be performed by any suitable removaltool 14 as previously described. Preferably, the removal is performed bymoving a tool, e.g., router 18, along a single direction (i.e.,unidirectional). However, it will be recognized by one skilled in theart that movement of the substrate material relative to a singulationtool may also be used to perform the removal of interconnect material,e.g., movement provided by motor driven apparatus 16 (FIG. 1).

[0045] Various other features of the circuit board substrate assembly 20are shown in FIGS. 1, 3, and 4. For example, injection regions 52 areshown which facilitate molding or encapsulating circuit components orother contents populating circuit forming regions 25. For example, suchinjection regions 52, i.e., injection gate regions, may be formed ofmetal materials, such as gold, so that encapsulation materials will notstick to such regions.

[0046] Also shown in such Figures are various alignment holes 44, 46 foraligning the circuit board substrate assembly 20 for various processtechniques to be performed relative to the substrate material 21, aswould be known to one skilled in the art. Further, such alignment holesmay be utilized for orientating the circuit board substrate assembly 20relative to material removal tool 14 for removal of interconnectmaterial as previously described. Further, identification marks 54 areshown in the encapsulating or molding material 50 for pin or leadidentification purposes during later processing.

[0047] The openings 24 defined in the circuit board substrate material21 may be provided by one of various processes. Such processing ordefinition of the openings 24 are provided prior to the processing stepsutilized in forming the encapsulated circuit portion 31 relative in thecircuit forming regions 25 of the circuit board substrate material 21.For example, the openings 24 may be defined in the circuit boardsubstrate material 21 by molding during the formation of the circuitboard substrate material 21 or may be defined therein after thesubstrate material is formed. For example, the openings may be routed,punched, laser cut, water jet cut, etc. Having the openings 24 formedprior to processing of the panel of substrate material 21, e.g.,soldering, encapsulating, etc., reduces the amount of routing necessaryto singulate after circuit portions have been formed. Excessive routingresults in various problems as previously described.

[0048] As shown in FIG. 5, a stack 70 of circuit board substrateassemblies 72, 74, 76 may be singulated at the same time. For example,each of the circuit board substrate assemblies 72, 74, 76 includecircuit board portions 79 and openings 70 of like size and orientation.For example, the openings 78 of the circuit board substrate assemblies72, 74, 76 are aligned in columns as shown by reference numbers 80-83.Stack 70 may be singulated by a material removal tool having sufficientdepth to remove material from the entire stack 70 of circuit boardsubstrate assemblies 72, 74, 76 along the singulation axes like thoseshown and described above.

[0049] Further, as shown in FIG. 6, singulation may be performed on acircuit board substrate assembly 90 including a matrix of individualcircuit board portions 108 separated by openings 106. As shown in FIG.6, the circuit board portions 108 lie along a corresponding axis of arow of circuit board portions. For example, a plurality of circuit boardportions 108 lie along longitudinal axis 93 of row 92, a plurality ofcircuit board portions 108 lie along a longitudinal axis 95 of row 94,and a plurality of circuit board portions 108 lie along a longitudinalaxis 97 of row 96. Rows 92 and 94 are separated by a singulation axis100 defined therebetween which intersects with openings 106 separatingthe individual circuit portions 108 lying in rows 92 and 94. Likewise, asingulation axis 102 is defined between rows 94 and 96. With singulationalong singulation axes 100, 102 and, further, with removal ofinterconnect material along axes 98, 104, each of the plurality ofcircuit board portions 108 is singulated from the whole of the circuitboard substrate assembly 90.

[0050] All patents or other references cited herein are incorporated intheir entirety as if each were incorporated separately. Where thisinvention has been described with reference to illustrative embodiments,this description is not meant to be construed in a limiting sense.Various modifications of the illustrative embodiments, as well asadditional embodiments of the invention, will be apparent to personsskilled in the art upon reference to this description. It is thereforecontemplated that the appended claims will cover any such modificationsor embodiments as fall within the scope of the present invention asdefined by the accompanying claims.

What is claimed is:
 1. A singulation method comprising the steps of:providing a generally planar circuit board substrate assembly having alongitudinal axis extending between a first end and a second end, thecircuit board substrate assembly including a plurality of circuit boardportions lying along the longitudinal axis, at least two of theplurality of circuit board portions separated by an opening andconnected by interconnect material; and removing at least a portion ofthe interconnect material along a first singulation axis and a secondsingulation axis extending substantially parallel to the longitudinalaxis to singulate at least two circuit board portions, the firstsingulation axis and the second singulation axis intersecting withrespective first and second portions of the opening.
 2. The method ofclaim 1, wherein the step of removing interconnect material along thefirst singulation axis and the second singulation axis includes moving asingulation tool along the first singulation axis and the secondsingulation axis.
 3. The method of claim 2, wherein the step of moving asingulation tool along the first singulation axis and the secondsingulation axis includes moving a routing tool along the firstsingulation axis and the second singulation axis.
 4. The method of claim1, wherein the opening is a single slot extending generallyperpendicular to the longitudinal axis between adjacent circuit boardportions.
 5. The method of claim 1, wherein each of the plurality ofcircuit board portions is separated from another of the plurality ofcircuit board portions by an opening, the first singulation axis and thesecond singulation axis intersecting respective first and secondportions of each of the openings such that when the interconnectmaterial is removed each of the circuit board portions is singulatedfrom the other circuit board portions.
 6. The method of claim 5, whereineach of the openings is a single slot extending generally perpendicularto the longitudinal axis between adjacent circuit portions, the firstand second portions of each opening being at opposing ends of the slot.7. A singulation method comprising the steps of: providing a circuitboard substrate assembly having a longitudinal axis extending between afirst end and a second end of the circuit board substrate assembly, thecircuit board substrate assembly including a plurality of openingspositioned along the longitudinal axis, each of the plurality ofopenings separating two circuit forming regions of a plurality ofcircuit forming regions connected by interconnect material; forming oneor more circuit portions in one or more of the circuit forming regions;and removing at least a portion of the interconnect material along afirst singulation axis and a second singulation axis extendingsubstantially parallel to the longitudinal axis, the first singulationaxis and the second singulation axis intersecting with respective firstand second open portions of each of the openings such that when thematerial is removed each of the plurality of circuit forming regions aresingulated.
 8. The method of claim 7, wherein the step of removingmaterial along the first and the second singulation axis includes movinga singulation tool along the first and the second singulation axis. 9.The method of claim 8, wherein the step of moving a singulation toolalong the first and the second singulation axis includes moving arouting tool along the first and the second singulation axis.
 10. Themethod of claim 7, wherein the opening is a single slot extendinggenerally perpendicular to the longitudinal axis between adjacentcircuit forming regions.
 11. The method of claim 7, wherein a pluralityof the circuit board substrate assemblies having one or more circuitsformed thereon are stacked, removal of interconnect material beingsimultaneously removed from each of the circuit board substrateassemblies.
 12. A singulation method comprising the steps of: providingan elongate circuit board substrate assembly having a longitudinal axisextending along a length of the circuit board substrate assembly betweena first end and a second end thereof, the circuit board substrateassembly further having a first edge and a second edge extending alongthe length of the circuit board substrate assembly between the first andsecond end; providing a plurality of formed circuit portions along thelongitudinal axis of the elongate circuit board substrate assembly, eachof the plurality of formed circuit portions having a perimeter locatedat least a minimum distance from each of the first edge and second edgeof the circuit board substrate assembly, each pair of adjacent formedcircuit portions of the plurality of formed circuit portions beingseparated by an opening, the opening extending between a positionlocated less than a maximum distance from each of the first edge andsecond edge of the circuit board substrate assembly, the minimumdistance being greater than the maximum distance; and removinginterconnect material along a first singulation axis and a secondsingulation axis at each respective first and second edges of thecircuit board substrate assembly extending substantially parallel to thelongitudinal axis, the first singulation axis and the second singulationaxis intersecting with first and second open portions of each of theopenings such that when the interconnect material is removed theplurality of formed circuit portions are singulated.
 13. The method ofclaim 12, wherein the step of removing material along the firstsingulation axis and the second singulation axis includes moving asingulation tool along the first singulation axis and the secondsingulation axis.
 14. The method of claim 13, wherein the step of movinga singulation tool along the first singulation axis and the secondsingulation axis includes moving a routing tool along the firstsingulation axis and the second singulation axis.
 15. The method ofclaim 12, wherein the circuit board substrate assembly is of a generallyrectangular configuration and each opening is a single slot extendinggenerally perpendicular to the longitudinal axis between adjacent formedcircuit portions.
 16. A singulation method comprising the steps of:providing a circuit board substrate assembly including a matrix ofcircuit board portions, the matrix of circuit board portions includingtwo or more rows of circuit board portions, each row of circuit boardportions formed along a corresponding longitudinal axis extendingbetween a first end and a second end of the circuit board substrateassembly, each of the circuit board portions of the plurality of circuitboard portions lying along each of the two or more rows being separatedfrom an adjacent circuit board portion in the same row by an opening;and moving a singulation tool along a plurality of singulation axesextending substantially parallel to one another and parallel to thecorresponding longitudinal axis of each row of circuit portions tosingulate the matrix of circuit portions, the plurality of singulationaxes including at least one singulation axis between adjacent rows ofcircuit board portions which intersects with a portion of one or moreopenings separating the plurality of circuit board portions lying alongeach of the adjacent rows.
 17. A circuit board substrate assemblycomprising: a generally planar circuit board substrate material having alongitudinal axis extending along a length of the substrate materialbetween a first end and a second end thereof, the circuit boardsubstrate material further having a first edge and a second edgeextending along the length of the circuit board substrate materialbetween the first end and the second end; and a plurality of openingsdefined in the substrate material, each opening extending between afirst distance from the first edge of the circuit board substrate and asecond distance from the second edge of the circuit board substrate,each opening separating adjacent circuit forming regions lying along thelongitudinal axis, and further wherein each opening has a first andsecond opposing end portion with the first end portions of each openinglying along a first singulation axis of the substrate material parallelto the longitudinal axis and the second end portions of each openinglying along a second singulation axis of the substrate material parallelto the longitudinal axis.
 18. The assembly of claim 17, wherein thecircuit board substrate material is of a generally rectangularconfiguration and each opening is a single slot extending generallyperpendicular to the longitudinal axis between the adjacent circuitforming regions.
 19. The assembly of claim 17, further comprising one ormore circuits formed in the circuit forming regions of the substratematerial resulting in a plurality of individual circuit board portionswherein a perimeter of each of the plurality of individual circuit boardportions located at least a minimum distance from each of the first andsecond edges of the circuit board substrate material, the minimumdistance being greater than the first and second distances.
 20. Theassembly of claim 19, wherein one or more circuits include ball gridarray configurations.
 21. The assembly of claim 19, wherein one or morecircuits include surface mount component configurations.
 22. A circuitboard substrate assembly comprising a substrate material having firstand second opposed edges, the substrate material comprising: a pluralityof circuit forming regions comprising at least one pair of adjacentcircuit forming regions; a first interconnection region and a secondinterconnection region, wherein the first interconnection region extendsalong the first edge and is located between the first edge and theplurality of circuit forming regions, wherein the second interconnectionregion extends along the second edge and is located between the secondedge and the plurality of circuit forming regions; and at least oneopening defined in the substrate material between each pair of adjacentcircuit forming regions, wherein the at least one opening extends intoat least portions of both the first interconnection region and secondinterconnection region.
 23. The assembly of claim 22, wherein thesubstrate material further comprises a first end and a second end,wherein the plurality of circuit forming regions lie along a length ofthe substrate material between the first end and the second end, thelength being defined along a longitudinal axis.
 24. The assembly ofclaim 23, wherein both the first edge and second edge of the substratematerial are substantially parallel to the longitudinal axis.
 25. Theassembly of claim 23, wherein the at least one opening comprises a firstand second opposing end portion with the first end portion thereof lyingalong a first singulation axis of the substrate material parallel to thelongitudinal axis and the second end portion of the at least one openinglying along a second singulation axis of the substrate material parallelto the longitudinal axis.
 26. The assembly of claim 23, wherein the atleast one opening is a single slot extending generally orthogonal to thelongitudinal axis.
 27. The assembly of claim 23, further comprising oneor more circuits formed in the circuit forming regions of the substratematerial resulting in a plurality of individual circuit board portions,wherein at least one of the plurality of individual circuit boardportions has a length orthogonal to the longitudinal axis.
 28. Theassembly of claim 27, wherein the at least one opening has a length thatis orthogonal to the longitudinal axis, and further wherein the lengthof the at least one opening is greater than the length of the at leastone of the plurality of individual circuit board portions.
 29. Theassembly of claim 27, wherein the one or more circuits comprise ballgrid array configurations.
 30. The assembly of claim 27, wherein the oneor more circuits comprise surface mount component configurations. 31.The assembly of claim 22, wherein the at least one opening comprises aslot extending into at least portions of the first and secondinterconnection regions.
 32. The assembly of claim 22, wherein the atleast one opening between each pair of adjacent circuit forming regionsis configured such that the plurality of circuit forming regions areseparable by using a material removal tool operable to move along one ormore parallel singulation axes to remove at least portions of the firstand second interconnection regions.
 33. A circuit board substrateassembly comprising a substrate material, wherein the substrate materialcomprises a plurality of rows of circuit forming regions lying along alength of the substrate material, wherein each row comprises at leastone pair of adjacent circuit forming regions, wherein a singulation axisis defined between each pair of adjacent rows, wherein at least one pairof adjacent circuit forming regions in at least one row is separated byat least one opening defined in the substrate material that intersectswith a singulation axis defined between the at least one row and anadjacent row, and that further intersects with a singulation axisdefined between the at least one row and another adjacent row.
 34. Theassembly of claim 33, wherein the substrate material further comprises aplurality of columns of circuit forming regions.
 35. The assembly ofclaim 33, wherein the substrate material further comprises: first andsecond opposed edges; and a first interconnection region and a secondinterconnection region, wherein the first interconnection region extendsalong the first edge and is located between the first edge and a firstend row of the plurality of rows of circuit forming regions, wherein thesecond interconnection region extends along the second edge and islocated between the second edge and a second end row of the plurality ofrows of circuit forming regions, and further wherein one or moreopenings defined in the substrate material separating adjacent circuitforming regions in the first and second rows extend into at least one ormore portions of the first interconnection region and secondinterconnection region, respectively.
 36. The assembly of claim 33,wherein the plurality of rows of circuit forming regions lie along alength of the substrate material, the length being defined along alongitudinal axis.
 37. The assembly of claim 36, wherein the substratematerial further comprises a first edge and a second edge, wherein boththe first edge and a second edge of the substrate material aresubstantially parallel to the longitudinal axis.
 38. The assembly ofclaim 36, wherein the at least one opening has a first and secondopposing end portion, the first end portion of each opening lying alonga first singulation axis of the substrate material parallel to thelongitudinal axis and the second end portion of the at least one openinglying along a second singulation axis of the substrate material parallelto the longitudinal axis. 39 The assembly of claim 38, wherein the atleast one opening is a single slot extending generally perpendicular tothe longitudinal axis.
 40. The assembly of claim 36, further comprisingone or more circuits formed in the adjacent circuit forming regions ofthe substrate material resulting in adjacent individual circuit boardportions, wherein the adjacent individual circuit board portions have alength orthogonal to the longitudinal axis.
 41. The assembly of claim40, wherein the at least one opening separating the adjacent individualcircuit board portions has a length that is orthogonal to thelongitudinal axis, and further wherein the length of the at least oneopening is greater than the length of the adjacent individual circuitboard portions.
 42. The assembly of claim 40, wherein the one or morecircuits comprise ball grid array configurations.
 43. The assembly ofclaim 40, wherein the one or more circuits comprise surface mountcomponent configurations.
 44. The assembly of claim 36, wherein the atleast one opening comprises a slot orthogonal to the longitudinal axis.45. The assembly of claim 36, wherein the at least one opening isconfigured such that the plurality of circuit forming regions areseparable by using a material removal tool operable to move along one ormore singulation axes.
 46. The assembly of claim 45, wherein thematerial removal tool comprises a routing tool.
 47. A circuit boardsubstrate assembly comprising: a substrate material having a lengthdefined along a longitudinal axis; a plurality of rows of circuitforming regions of the substrate material aligned parallel to thelongitudinal axis; one or more circuits formed in the circuit formingregions resulting in rows of individual circuit portions lying along thelength of the substrate material parallel to the longitudinal axis,wherein each individual circuit portion comprises a first end portionand a second end portion, and further wherein each individual circuitportion in a row is separated from each adjacent individual circuitportion in the row by an opening; a plurality of interconnection regionsextending along the length of the substrate material parallel to thelongitudinal axis, wherein the first and second end portions of eachindividual circuit portion are adjacent to an interconnection region;and a singulation axis defined along the length of the substratematerial within each of the plurality of interconnection regions,wherein each singulation axis is parallel to the longitudinal axis,wherein the opening separating each individual circuit portion in a rowfrom each adjacent circuit portion in the row extends into aninterconnection region adjacent the first end portion of the individualcircuit portion and intersects with a singulation axis lying within suchinterconnection region, and further wherein such opening extends into aninterconnection region adjacent the second end portion of the individualcircuit portion and intersects a singulation axis lying within suchinterconnection region.
 48. The assembly of claim 47, wherein theopening is a single slot extending generally orthogonal to thelongitudinal axis.
 49. The assembly of claim 47, wherein at least one ofthe individual circuit board portions has a length orthogonal to thelongitudinal axis extending between the first end portion and second endportion thereof.
 50. The assembly of claim 49, wherein the opening has alength that is orthogonal to the longitudinal axis, and further whereinthe length of the opening is greater than the length of the at least oneindividual circuit board portion.
 51. The assembly of claim 47, whereinthe opening comprises a slot.
 52. The assembly of claim 47, wherein theopening is configured such that the individual circuit board portionsare separable by using a material removal tool operable to move alongone or more of the singulation axes defined along the length of thesubstrate material.
 53. The assembly of claim 47, wherein one or more ofthe individual circuit portions comprise ball grid array configurations.54. The assembly of claim 47, wherein one or more of the individualcircuit portions comprise surface mount component configurations.
 55. Acircuit board substrate assembly comprising: a substrate material havinga length defined along a longitudinal axis; a plurality of rows ofcircuit forming regions of the substrate material aligned parallel tothe longitudinal axis; one or more circuits formed in the circuitforming regions resulting in a plurality of rows of individual circuitportions lying along the length of the substrate material parallel tothe longitudinal axis, wherein each individual circuit portion in a rowis separated from each adjacent individual circuit portion in the row byan opening; at least one row of the plurality of rows of individualcircuit portions being adjacent a first interconnection region and asecond interconnection region, wherein the first interconnection regionand the second interconnection region lie along the length of thesubstrate material parallel to the longitudinal axis, wherein the firstinterconnection region is located between the at least one row ofindividual circuit portions and an adjacent row of individual circuitportions, and further wherein the second interconnection region islocated between the at least one row of individual circuit portions andanother adjacent row of individual circuit portions; and a firstsingulation axis and a second singulation axis, wherein the firstsingulation axis and the second singulation axis lie along the length ofthe substrate material parallel to the longitudinal axis, wherein thefirst singulation axis is defined in the first interconnection region,wherein the second singulation axis is defined in the secondinterconnection region, wherein the opening separating each individualcircuit portion of the at least one row from each adjacent circuitportions in the at least one row extends into the first interconnectionregion and the second interconnection region, and further wherein theopening intersects the first singulation axis and the second singulationaxis.
 56. The assembly of claim 55, wherein the opening is a single slotextending generally orthogonal to the longitudinal axis.
 57. Theassembly of claim 55, wherein at least one of the individual circuitportions has a length orthogonal to the longitudinal axis.
 58. Theassembly of claim 57, wherein the opening has a length that isorthogonal to the longitudinal axis, and further wherein the length ofthe opening is greater than the length of the at least one individualcircuit portion.
 59. The assembly of claim 55, wherein the openingcomprises a slot.
 60. The assembly of claim 55, wherein the opening isconfigured such that the individual circuit portions are separable byusing a material removal tool operable to move along one or more of thesingulation axes.
 61. The assembly of claim 55, wherein one or more ofthe individual circuit portions comprise ball grid array configurations.62. The assembly of claim 55, wherein one or more of the individualcircuit portions comprise surface mount component configurations.
 63. Asingulation method comprising: providing a circuit board substrateassembly comprising a substrate material having first and second opposededges, the substrate material comprising: a plurality of circuit formingregions comprising at least one pair of adjacent circuit formingregions; a first interconnection region and a second interconnectionregion, wherein the first interconnection region extends along the firstedge and is located between the first edge and the plurality of circuitforming regions, wherein the second interconnection region extends alongthe second edge and is located between the second edge and the pluralityof circuit forming regions; and at least one opening defined in thesubstrate material between each pair of adjacent circuit formingregions, wherein the at least one opening extends into at least portionsof both the first interconnection region and second interconnectionregion. removing at least a portion of the first and secondinterconnection regions along a respective first and second singulationaxis defined therein parallel to one another to singulate at least twocircuit forming regions of the plurality of circuit forming regions, thefirst singulation axis and the second singulation axis intersecting withthe at least one opening defined between each pair of adjacent circuitforming regions.
 64. The method of claim 63, wherein removing at least aportion of the first and second interconnection regions comprises movinga singulation tool along the first singulation axis and the secondsingulation axis.
 65. The method of claim 64, wherein moving asingulation tool along the first singulation axis and the secondsingulation axis comprises moving a routing tool along the firstsingulation axis and the second singulation axis.
 66. A singulationmethod comprising: providing a circuit board substrate assemblycomprising a substrate material, wherein the substrate materialcomprises a plurality of rows of circuit forming regions lying along alength of the substrate material, wherein each row comprises at leastone pair of adjacent circuit forming regions, wherein a singulation axisis defined between each pair of adjacent rows, wherein at least one pairof adjacent circuit forming regions in at least one row is separated byat least one opening defined in the substrate material that intersectswith a singulation axis defined between the at least one row and anadjacent row, and that further intersects with a singulation axisdefined between the at least one row and another adjacent row; andremoving at least a portion of the substrate material along eachsingulation axes to singulate the at least one pair of adjacent circuitforming regions of the at least one row of circuit forming regions. 67.The method of claim 66, wherein removing at least a portion of thesubstrate material comprises moving a singulation tool along each of thesingulation axes.
 68. The method of claim 67, wherein moving asingulation tool along each of the singulation axes comprises moving arouting tool along each of the singulation axes.